Katie Finney /
This is the second blog of the Frequently Asked Questions mini-series. This mini-series discusses the frequently asked questions for the 3800 Die Bonder, 8000i Wire Bonder, and the 9000 Wedge Bonder. Check back each week to see the most frequently asked questions for your favorite machines. This week we are discussing the 8000i Wire Bonder. We have split the frequently asked questions for the 8000i into two blogs, since there are so many questions. Check back next week for part two. 8000i Wire Bonder What is the total bonding area that you can vision and bond to? What is the range of capillary lengths the 8000i can bond with? What can we do if we cannot heat the package up to 150C? Can the system perform both ball bumping and traditional wire bonding with traditional wire and capillaries? What types/sizes of heated stages do you offer? Can the system be configured with a tool heater? Can the system be configured with a material handling system? What ultrasonic frequency does the bonder run at, and can the system be configured for High Frequency Ultrasonics? Download these resources for more information: If you have more questions about the 8000i Wire Bonder, please contact Katie Finney at kfinney@bonders.com. Don’t miss the second part of the frequently asked questions for the 8000i next week. ---- Bradley BentonRegional Account Manager, Western Americas
12” (305mm) in the X axis, 6” (152mm) in the Y axis
The Model 8000i can bond with a wide range of capillaries.We recommend using the shortest cap that works with your application. The most common length is 0.437”. If that is too short, then next typical length is 0.625”. You can bond with high reliability all the way up to a 0.750” cap. There are other sizes that work in between these typical lengths as well:
A number of methods for adding ‘activation energy’ to the bond can be employed.In all cases, we still recommend that you heat the bottom of the package as hot as possible, up to 150⁰C. If you can heat the package from the bottom to approximately 85-125⁰C, we can add the last bit of energy by heating the capillary itself with what we call a ‘tool heater.’ This is a temperature controlled inductive coil that wraps a number of times around the capillary. In some cases, this coil is driven quite hard, up to the low 300⁰C region. It does reduce some clearances and depth access, so your application needs to be reviewed prior to launching down this pathway.It does provide a robust solution to lower package temperatures.
Yes, it can.The 8000i Wire Bonders’ compound Z-Axis allows the system to bond traditional ball/stitch wires, ball bumps or stacked ball bumps of many shapes and sizes, or a combination of the two that we call “Stand-Off Stitch” bonding.The SoS mode provides the highest degree of reliability available for ball bonders on the market today.
Yes, the 8000i Wire Bonder can be configured to use the option tool heater, either at the factory prior to acceptance testing or later in the field at the customer’s site.
Yes, the system can have a variety of material handlers: Inline handlers, push-pull handlers, auto-continuous handlers, etc.each with its own custom tooling. These options can be manually fed materials, or for the inline handlers, low and high capacity up and downstream magazine handlers that can connect via a true SMEMA interface.
The standard system operates at 60 KHz. This is highly recommended, as higher frequencies come at a process capability price. The unit can also be converted, at the factory or in the field to 120 KHz ultrasonics. These high frequency options allow for better bonding at lower temperatures and can provide a finer pitch result.8000i Data Sheet i2Gi® eBook Field Services Data Sheet 
Palomar Technologies, Inc.
